Display device

A display device comprising:

• a substrate including silicon (Si);
• a light-emitting element layer on an upper surface of the substrate;
• a thin-film substrate connected to the upper surface of the substrate, the thin-film substrate spaced apart from the light-emitting element layer in a horizontal direction;
• a first semiconductor chip on a lower surface of the substrate, at least a portion of the first semiconductor chip overlapping with the thin-film substrate in a vertical direction;
• a molding layer on the lower surface of the substrate, the molding layer surrounding a sidewall of the first semiconductor chip;
• and
• a first through-via extending through the substrate in the vertical direction, the first through-via electrically connecting the thin-film substrate and the first semiconductor chip to each other.

A display device comprising:

• a substrate including a display region and a non-display region adjacent to the display region in a horizontal direction, the substrate including silicon (Si);
• a light-emitting element layer on an upper surface of the substrate in the display region;
• an upper substrate on the light-emitting element layer in the display region;
• a thin-film substrate in the non-display region, one end of the thin-film substrate connected to the upper surface of the substrate;
• a circuit board connected to an opposite end of the thin-film substrate;
• a semiconductor chip on a lower surface of the substrate, at least a portion of the semiconductor chip overlapping with the thin-film substrate in a vertical direction;
• a molding layer on the lower surface of the substrate, the molding layer surrounding a sidewall of the semiconductor chip, a lower surface of the molding layer being coplanar with a lower surface of the semiconductor chip, a sidewall of the molding layer aligned with a sidewall of the substrate in the vertical direction;
• a first through-via in the non-display region, the first through-via extending through the substrate in the vertical direction, the first through-via electrically connecting the thin-film substrate and the semiconductor chip to each other;
• a second through-via in the non-display region, to the second through-via extending through the substrate in the vertical direction, the second through-via spaced apart from the first through-via in the horizontal direction, the second through-via electrically connected to the semiconductor chip;
• and
• a conductive pad on the upper surface of the substrate, the conductive pad electrically connecting the second through-via and the light-emitting element layer to each other.