Display device and method for manufacturing the same

A display device comprising:

• a first substrate including:
• a base substrate;
• a thin-film transistor disposed on the base substrate;
• a first planarization layer disposed on the thin-film transistor;
• a first reflective electrode pattern disposed on the first planarization layer;
• a second reflective electrode pattern spaced apart from the first reflective electrode pattern;
• and
• a second substrate including:
• a self-assembly substrate having an assembly groove defined therein;
• a lower wiring electrode disposed on the assembly groove;
• a light-emitting element disposed in the assembly groove and having one side contacting the lower wiring electrode;
• a protective layer covering the light-emitting element and not covering a portion of a surface of the lower wiring electrode so as to be exposed;
• a second wiring electrode including an upper wiring electrode disposed on the protective layer and in contact with the lower wiring electrode;
• and
• a first wiring electrode contacting the other side of the light-emitting element;
• and
• a pair of bonding pads respectively overlapping the first and second reflective electrode patterns of the first substrate, wherein one of the bonding pads electrically connects the second reflective electrode pattern and the first wiring electrode to each other, wherein another of the bonding pads electrically connects the first reflective electrode pattern and the second wiring electrode to each other, wherein the bonding pads bond the first and second substrates to each other.

A method for manufacturing a display device, the method comprising:

• providing a first substrate including:
• a base substrate;
• a thin-film transistor disposed on the base substrate;
• a first planarization layer disposed on the thin-film transistor;
• a first reflective electrode pattern disposed on the first planarization layer;
• a second reflective electrode pattern spaced apart from the first reflective electrode pattern;
• and
• bonding pads respectively overlapping the first and second reflective electrode patterns;
• providing a second substrate including:
• a self-assembly substrate;
• a black bank disposed on the self-assembly substrate;
• a planarization layer disposed on the black bank and having an assembly groove defined therein;
• and
• a pair of assembly electrodes disposed between the black bank and the planarization layer and respectively disposed on both opposing sides of the assembly groove disposed therebetween;
• aligning a light-emitting element having an electrode with the assembly groove of the second substrate so as to be received in the assembly groove;
• forming a protective layer on the self-assembly substrate including the light-emitting element so as to have an opening defined therein exposing a portion of a surface of the electrode of the light-emitting element;
• forming a wiring electrode on the protective layer so as to be in contact with the electrode;
• and
• arranging the second substrate including the wiring electrode and the first substrate vertically, and bonding the first substrate and the second substrate to each other via the bonding pads disposed therebetween.