Manufacturing method of electronic device
AssigneeInnolux Corporation
InventorChun-Hui HUANG
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Abstract
The disclosure provides a manufacturing method of an electronic device, which comprises providing a first substrate, the first substrate comprises a plurality of transfer regions, each transfer region comprises a plurality of electronic components, picking up a first group of electronic components from one of the transfer regions, and transferring the first group of electronic components to a target substrate, the diagonal length of the target substrate is L, and the first group of electronic components are arranged in a matrix, and a length M of the matrix in a horizontal direction is greater than or equal to 0.315 L and less than L.
Claims20
A manufacturing method of an electronic device, comprising:
- providing a first substrate, wherein the first substrate comprises a plurality of transfer regions, and each transfer region comprises a plurality of electronic components;
- picking up a first group of electronic components from one of the transfer regions;
- and
- transferring the first group of electronic components to a target substrate;
- wherein the diagonal length of the target substrate is L, the first group of electronic components are arranged in a matrix, and the length M of the matrix in a horizontal direction is greater than or equal to 0.315 L and less than L.
A manufacturing method of an electronic device, comprising:
- providing a first substrate, wherein the first substrate comprises a plurality of transfer regions, and each transfer region comprises a plurality of electronic components;
- picking up a first group of electronic components from one of the transfer regions;
- transferring the first group of electronic components to a first region on a target substrate;
- picking up a second group of electronic components from one of the transfer regions;
- and
- transferring the second group of electronic components to a second region on the target substrate;
- wherein the first region and the second region are not adjacent to each other.
A manufacturing method of an electronic device, comprising:
- providing a first substrate, wherein the first substrate comprises a plurality of transfer regions, and each transfer region comprises a plurality of electronic components;
- picking up a first group of electronic components from a first transfer region of the transfer regions;
- transferring the first group of electronic components to a first region on a target substrate;
- picking up a second group of electronic components from a second transfer region of the transfer regions;
- and
- transferring the second group of electronic components to a second region on the target substrate;
- wherein the relative positions of the first transfer region and the second transfer region on the first substrate are the same as the relative positions of the first region and the second region on the target substrate.
Dependencies are inferred from the claim text.