Back to results
US 2024/0258372 A1Published application
Electronic component and package including stress release structure as lateral edge portion of semiconductor body
AssigneeInfineon Technologies AG
InventorsSebastian POLSTER, Alexander HEINRICH, Martin Richard NIESSNER
Life of this patent
Estimating the term…
Abstract
An electronic component is disclosed. The electronic component comprises a semiconductor body, an active region in a central portion of the semiconductor body, and a stress release structure for releasing stress and being formed as a lateral edge portion of the semiconductor body. The lateral edge portion has a minimum thickness of not more than 40% of a maximum thickness of the semiconductor body.
Claims20
An electronic component, comprising:
- a semiconductor body;
- an active region in a central portion of the semiconductor body;
- and
- a stress release structure for releasing stress and being formed as a lateral edge portion of the semiconductor body, said lateral edge portion having a minimum thickness of not more than 40% of a maximum thickness of the semiconductor body.
1 more element
A method of manufacturing an electronic component, wherein the method comprises:
- forming an active region in a central portion of a semiconductor body;
- and
- forming a stress release structure for releasing stress as a lateral edge portion of the semiconductor body, said lateral edge portion being formed with a minimum thickness of not more than 40% of a maximum thickness of the semiconductor body.
Dependencies are inferred from the claim text.