Integrated device comprising plate interconnects and a magnetic material

A device comprising:

• (i) a first integrated device comprising:
• a die substrate;
• a plurality of interconnects located over the die substrate,
• wherein the plurality of interconnects comprise:
• a first plurality of plate interconnects;
• a second plurality of plate interconnects;
• and
• a plurality of via interconnects coupled to the first plurality of plate interconnects and the second plurality of plate interconnects, and
• wherein the first plurality of plate interconnects, the plurality of via interconnects and the second plurality of plate interconnects are configured to operate as an inductor;
• at least one magnetic layer that surrounds at least part of the plurality of via interconnects;
• and
• at least one dielectric layer located over the die substrate;
• (ii) a second integrated device configured as a power management integrated device, wherein the second integrated device is configured to be electrically coupled to the first integrated device through a first electrical path;
• and
• (iii) a third integrated device configured to be electrically coupled to the first integrated device through a second electrical path.

A method comprising:

• providing a die substrate;
• forming a plurality of interconnects over the die substrate, wherein forming the plurality of interconnects comprises:
• forming a first plurality of plate interconnects;
• forming a plurality of via interconnects that coupled are coupled to the first plurality of plate interconnects;
• and
• forming a second plurality of plate interconnects that are coupled to the plurality of via interconnects,
• wherein the first plurality of plate interconnects, the plurality of via interconnects and the second plurality of plate interconnects are configured to operate as an inductor;
• and
• forming at least one magnetic layer that surrounds at least part of the plurality of via interconnects;
• and
• forming at least one dielectric layer over the die substrate.