Image sensor with stack structure and manufacturing method thereof
AssigneeSamsung Electronics Co., Ltd.
InventorsByungjun PARK, Jieun KIM, Woojae JANG
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AssigneeSamsung Electronics Co., Ltd.
InventorsByungjun PARK, Jieun KIM, Woojae JANG
Estimating the term…
An image sensor may include a first semiconductor chip including a pixel area and a peripheral area, the pixel area including a plurality of pixels, and a second semiconductor chip coupled to a lower surface of the first semiconductor chip, the second semiconductor chip including a plurality of logic elements, the pixel area including a plurality of color filters and a fence in the pixel area, the plurality of color filters corresponding to the plurality of pixels, the fence having a grid pattern, and each of the color filters of the plurality of color filters separated from each other by the fence, the peripheral area including a shield area and a shield outer area, the shield area surrounding the pixel area, and a fence insulating layer included in the shield outer area, the fence insulating layer including a same material as the fence.
An image sensor with a stack structure, the image sensor comprising:
An image sensor with a stack structure, the image sensor comprising:
An image sensor with a stack structure, the image sensor comprising:
-25. (canceled)
Dependencies are inferred from the claim text.