US 2024/0258296 A1 · MICROELECTRONIC ASSEMBLIES

Abstract

Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate having a surface; a first die, having opposing first and second surfaces, in a first dielectric layer, wherein the first dielectric layer is between a second dielectric layer and the surface of the package substrate, and the first surface of the first die is coupled to the surface of the package substrate; a second die, having opposing first and second surfaces, in the second dielectric layer, and wherein the second dielectric layer is between the first dielectric layer and a third dielectric layer; a third die, having opposing first and second surfaces, in the third dielectric layer, wherein the first surface of the third die is coupled to the surface of the package substrate by a conductive pillar; and a conductive, radio frequency shield structure surrounding the conductive pillar.

Claims20

Dependent claims

A microelectronic assembly, comprising:

a package substrate having a first surface and an opposing second surface;
a first die having a first surface and an opposing second surface, wherein the first die is in a first dielectric layer, wherein the first dielectric layer is between a second dielectric layer and the second surface of the package substrate, and wherein the first surface of the first die is coupled to the second surface of the package substrate;
a second die having a first surface and an opposing second surface, wherein the second die is in the second dielectric layer, and wherein the second dielectric layer is between the first dielectric layer and a third dielectric layer;
a third die having a first surface and an opposing second surface, wherein the third die is in the third dielectric layer, wherein the first surface of the third die is coupled to the second surface of the package substrate by a conductive pillar;
and
a conductive, radio frequency shield structure, wherein the shield structure surrounds the conductive pillar.

3 more elements

A computing device, comprising:

a microelectronic assembly, comprising:
a package substrate having a first surface and an opposing second surface;
a first die having a first surface and an opposing second surface, wherein the first die is in a first dielectric layer, wherein the first dielectric layer is between a second dielectric layer and the second surface of the package substrate, and wherein the first surface of the first die is coupled to the second surface of the package substrate;
a second die having a first surface and an opposing second surface, wherein the second die is in the second dielectric layer, and wherein the second dielectric layer is between the first dielectric layer and a third dielectric layer;
a third die having a first surface and an opposing second surface, wherein the third die is in the third dielectric layer, wherein the first surface of the third die is coupled to the second surface of the package substrate by a first conductive pillar, and wherein the first surface of the third die is coupled to the second surface of the second die by a second conductive pillar;
and
a conductive, radio frequency shield structure, wherein the shield structure surrounds the first conductive pillar.

4 more elements

Dependencies are inferred from the claim text.

Microelectronic assemblies

Life of this patent

Microelectronic assemblies

Life of this patent

Abstract

Claims20