Micro light emitting diode chip and method for manufacturing thereof
AssigneeSamsung Electronics Co., Ltd.
InventorsSungyong MIN, Changjoon LEE, Kyungwoon JANG
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Abstract
A micro light emitting diode (LED) chip includes: a first semiconductor layer doped with an N-type dopant; a second semiconductor layer provided at a lower surface of the first semiconductor layer, and doped with a P-type dopant; an active layer provided between the first semiconductor layer and the second semiconductor layer, and configured to emit light; and an electrode pad provided at a lower surface of the second semiconductor layer, wherein the electrode pad may include a groove structure having a depth that increases from an edge of the electrode pad towards a center of the electrode pad.
Claims14
A micro light emitting diode (LED) chip comprising:
- a first semiconductor layer doped with an N-type dopant;
- a second semiconductor layer provided at a lower surface of the first semiconductor layer, and doped with a P-type dopant;
- an active layer provided between the first semiconductor layer and the second semiconductor layer, and configured to emit light;
- and
- an electrode pad provided at a lower surface of the second semiconductor layer,
- wherein the electrode pad comprises a groove structure having a depth that increases from an edge of the electrode pad towards a center of the electrode pad.
A method for manufacturing a micro light emitting diode (LED) chip, the method comprising:
- sequentially forming a first semiconductor layer doped with an N-type dopant, an active layer configured to emit light, and a second semiconductor layer doped with a P-type dopant on a growth substrate;
- forming a pixel device electrically spaced apart by etching the first semiconductor layer, the active layer, and the second semiconductor layer;
- and
- forming an electrode pad over the pixel device,
- wherein the electrode pad comprises a groove structure having a depth that increases from an edge of the electrode pad towards a center of the electrode pad.
A method for manufacturing a micro light emitting diode (LED) panel, the method comprising:
- laminating an anisotropic conductive film on a panel substrate;
- forming a micro LED chip comprising an electrode pad comprising a groove structure that has a depth that increases an edge of the electrode pad towards a center of the electrode pad;
- transferring the micro LED chip onto the laminated panel substrate;
- and
- thermally compressing the panel substrate onto which the micro LED chip is transferred.
Dependencies are inferred from the claim text.