Active bridging apparatus
AssigneeAdeia Semiconductor Technologies LLC
InventorsJavier A. Delacruz, Belgacem Haba, Rajesh Katkar
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Abstract
Techniques and mechanisms for coupling chiplets to microchips utilizing active bridges. The active bridges include circuits that provide various functions and capabilities that previously may have been located on the microchips and/or the chiplets. Furthermore, the active bridges may be coupled to the microchips and the chiplets via “native interconnects” utilizing direct bonding techniques. Utilizing the active bridges and the direct bonding techniques of the active bridges to the microchips and the chiplets, the pitch for the interconnects can be greatly reduced going from a pitch in the millimeters to a fine pitch that may be in a range of less than one micron to approximately five microns.
Claims21
1-20. (canceled)
A device package comprising:
- a high bandwidth memory (HBM) chiplet;
- a system-on-chip (SoC) die;
- and
- an active bridge die hybrid bonded to the HBM chiplet and the SoC die, the active bridge die comprising an HBM controller layer and a memory cache.
Dependencies are inferred from the claim text.