Semiconductor packages using package in package systems and related methods

A semiconductor package comprising:

• two or more encapsulated die assemblies, each encapsulated die assembly comprising:
• two or more die, each of the two more die coupled to a metal layer at a drain of each of the two more die;
• a first interconnect layer coupled at a source of each of the two more die;
• a second interconnect layer electrically coupled to a gate of each of the two or more die;
• and
• an encapsulant surrounding the two or more die and at least a portion of the first interconnect layer, the metal layer, and the second interconnect layer;
• and
• one of a substrate or a leadframe coupled to the two or more encapsulated die assemblies.

A method of forming a semiconductor package, the method comprising:

• providing two or more die;
• coupling each of the two or more die to a metal layer at a drain of each of the two or more die, the two or more die and each metal layer arranged in two parallel planes;
• forming a first interconnect layer coupled to a source of each of the two or more die;
• encapsulating the two or more die, at least a portion of the first interconnect layer, and at least a portion of the metal layer with an encapsulant using one of a transfer molding or laminating process;
• and
• forming a second interconnect layer coupled to a gate of each of the two or more die;
• wherein the drain of each of the two or more die face the metal layer.