Semiconductor device package and methods of manufacture

A package comprising:

• a first die bonded to a first side of a first substrate using a plurality of first conductive connectors, wherein each of the plurality of first conductive connectors comprises a first conductive pillar adhered to a first solder bump, wherein the first conductive pillar has a uniform first width, and wherein the first solder bump comprises:
• a first portion of the first solder bump extending through a first solder resist layer that is disposed on the first substrate;
• and
• a second portion of the first solder bump having a hourglass shape;
• a package component bonded to a second side of the first substrate using a plurality of second conductive connectors, wherein each of the plurality of second conductive connectors comprises a second conductive pillar adhered to a second solder bump, wherein the second conductive pillar has a uniform second width;
• and
• through-vias extending through the first substrate to electrically connect the plurality of first conductive connectors to the plurality of second conductive connectors.