Bonding tool of flip chip laser bonding apparatus

A bonding tool of a flip chip laser bonding apparatus, comprising the bonding tool configured to press a semiconductor chip onto a substrate after fixing the semiconductor chip through vacuum adsorption, a laser generator installed above the bonding tool and configured to radiate a laser beam for bonding between the semiconductor chip and the substrate, and a non-contact thermometer configured to monitor a temperature of a surface of the semiconductor chip,

• wherein the bonding tool is formed of an optical window comprising a single crystal material able to transmit a laser wavelength range radiated by the laser generator, and is configured such that a vacuum hole for semiconductor chip adsorption is formed through the bonding tool so as to allow a vacuum supplied from a vacuum unit to pass therethrough, a vacuum wall configured to maintain the vacuum at a time of adsorbing the semiconductor chip is formed at outer parts of a contact surface of the bonding tool with the semiconductor chip, contact protrusions configured to reduce a contact area of the bonding tool with the semiconductor chip so as to control heat transfer from the semiconductor chip to the bonding tool are formed on the contact surface of the bonding tool with the semiconductor chip, and the contact protrusions are formed in a pattern configured such that a heat transfer area of the semiconductor chip to the bonding tool at a center of the semiconductor chip is relatively large and the heat transfer area is gradually reduced in a direction from the center of the semiconductor chip to outer parts of the semiconductor chip so as to achieve a uniform temperature distribution from the center of the semiconductor chip to the outer parts of the semiconductor chip.