Semiconductor device and method for manufacturing the same

A semiconductor device comprising:

• a semiconductor element having a first surface and a second surface opposite to the first surface in a thickness direction, the semiconductor element including a first main electrode disposed on the first surface, a second main electrode disposed on the second surface, and a signal pad disposed at a position different from the second main electrode on the second surface;
• a first wiring member electrically connected to the first main electrode;
• a second wiring member electrically connected to the second main electrode;
• a signal terminal;
• and
• a bonding wire electrically connecting the signal pad and the signal terminal, wherein
• the second wiring member is a substrate that includes an insulating base material, a front surface metal body, and a back surface metal body, the front surface metal body is disposed on a front surface of the insulating base material facing the semiconductor element and electrically connected to the second main electrode, and the back surface metal body is disposed on a back surface of the insulating base material opposite to the front surface,
• an end portion of the front surface metal body is located between an end portion of a bonding target to which the front surface metal body is bonded and an end portion of the semiconductor element in an arrangement direction in which the semiconductor element and the signal terminal are arranged,
• the insulating base material has an exposed portion exposed from the front surface metal body,
• a top portion of the bonding wire faces the exposed portion of the insulating base material in the thickness direction, and
• the bonding wire is in contact with the exposed portion of the insulating base material.