Multi-barrier system for low-void thermal transfer

Abstract

Described are a double barrier system and method used to contain a thermal interface material to avoid unwanted interactions of the thermal interface material with other metals or components within a semiconductor device. In one implementation, a semiconductor assembly includes: a substrate; a heat generating device including a first surface attached to the substrate; a first barrier surrounding and in touching relation with the heat generating device; a second barrier surrounding the first barrier such that there is an area between the first barrier and the second barrier; a heat transferring device; and a thermal interface material between and in touching relation with the heat transferring device and a second surface of the heat generating device opposite the first surface.

Dependencies are inferred from the claim text.