Encapsulated package including device dies connected via interconnect die
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsKuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu, Ting-Yu Yeh
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Abstract
A method includes bonding a first device die and a second device die to an interconnect die. The interconnect die includes a first portion over and bonded to the first device die, and a second portion over and bonded to the second device die. The interconnect die electrically connects the first device die to the second device die. The method further includes encapsulating the interconnect die in an encapsulating material, and forming a plurality of redistribution lines over the interconnect die.
Claims20
A method comprising:
- placing an interconnect die over a carrier;
- forming a through-via over the carrier;
- encapsulating the interconnect die and the through-via in an encapsulant;
- bonding a first device die and a second device die to the interconnect die;
- and
- removing the carrier.
A method comprising:
- forming a plurality of redistribution lines over a carrier;
- attaching an interconnect die to a surface of the plurality of redistribution lines through a first die-attach film;
- encapsulating the interconnect die in an encapsulating material;
- and
- after the encapsulating, bonding a first package component and a second package component to the interconnect die, wherein the first package component is electrically connected to the second package component through the interconnect die.
A method comprising:
- forming a plurality of redistribution lines over a carrier;
- attaching an interconnect die to a surface of the plurality of redistribution lines through a die-attach film, wherein the interconnect die is over both of the plurality of redistribution lines and the carrier;
- encapsulating the interconnect die in an encapsulating material;
- and
- bonding a first package component and a second package component to the interconnect die, wherein the first package component is electrically connected to the second package component through the interconnect die.
Dependencies are inferred from the claim text.