Semiconductor package including ball grid array connections with improved reliability
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShih-Cheng Chang, Yao-Chun Chuang
Life of this patent
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Abstract
A substrate or IC chip is connected with a second substrate or IC chip. This entails disposing electrically conductive balls on electrical bonding pads of a surface of the substrate or IC chip to form a ball grid array (BGA) disposed on the surface of the substrate or IC chip, and electrically and mechanically connecting the surface of the substrate or IC chip to the second substrate or IC chip using the BGA. An underfill material may be disposed on the surface of the substrate or IC chip around bonds between the balls and the electrical bonding pads. There may be at least two different types of electrically conductive balls in the BGA, such as solder balls and copper-based balls.
Claims20
A method of connecting a substrate or integrated circuit (IC) chip and a second substrate or IC chip, the method comprising:
- disposing electrically conductive balls on electrical bonding pads of a surface of the substrate or IC chip to form a ball grid array (BGA) disposed on the surface of the substrate or IC chip;
- and
- electrically and mechanically connecting the surface of the substrate or IC chip to the second substrate or IC chip using the BGA disposed on the surface of the substrate or IC chip;
- wherein the disposing of the electrically conductive balls on the electrical bonding pads of the surface of the substrate or IC chip to form the BGA includes at least one of:
- bonding the electrically conductive balls to the electrical bonding pads of the surface of the substrate or IC chip and disposing an underfill material on the surface of the substrate or IC chip around bonds between the electrically conductive balls and the electrical bonding pads;
- and/or
- disposing the electrically conductive balls of at least two different types on the electrical bonding pads of the surface of the substrate or IC chip to form the BGA comprising the electrically conductive balls of the at least two different types disposed on the surface of the substrate or IC chip.
A semiconductor package comprising:
- a substrate or integrated circuit (IC) chip having electrical bonding pads disposed on a surface of the substrate or IC chip;
- a second substrate or IC chip;
- and
- a ball grid array (BGA) electrically and mechanically connecting the surface of the substrate or IC chip to the second substrate or IC chip, the BGA including:
- electrically conductive balls bonded to the electrical bonding pads of the surface of the substrate or IC chip and to the second substrate or IC chip;
- and
- underfill material disposed on the surface of the substrate or IC chip around bonds between the electrically conductive balls and the electrical bonding pads of the surface of the substrate or IC chip.
A semiconductor package comprising:
- a substrate or integrated circuit (IC) chip having electrical bonding pads disposed on a surface of the substrate or IC chip;
- a second substrate or IC chip;
- and
- a ball grid array (BGA) electrically and mechanically connecting the surface of the substrate or IC chip to the second substrate or IC chip, the BGA including electrically conductive balls of at least two different types.
Dependencies are inferred from the claim text.