Assembly including terminal pads associated with conductive traces and having irregular surface topography, and related methods and electronic systems
AssigneeMicron Technology, Inc.
InventorTravis M. Jensen
Life of this patent
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Abstract
An apparatus comprising a substrate having conductive traces and associated integral terminal pads on a surface thereof, the terminal pads having an irregular surface topography formed in a thickness of a single material of the conductive traces and integral terminal pads. Solder balls may be bonded to the terminal pads, and one or more microelectronic components operably coupled to conductive traces of the substrate on a side thereof opposite the terminal pads. Methods of fabricating terminal pads on a substrate, and electronic systems including substrates having such terminal pads are also disclosed.
Claims20
A microelectronic component assembly, comprising:
- a first microelectronic component having first terminal pads on a surface thereof;
- a second microelectronic component having second terminals pads on an additional surface thereof facing the surface of the first microelectronic component, the first terminal pads and the second terminals pads respectively comprising:
- at least one protruding portion;
- and
- at least one recess portion;
- conductive traces associated with the first terminal pads and the second terminals pads, the conductive traces individually being integral with, having a same material composition as, and having a same thickness as the at least one protruding portion of a respective one of the first terminal pads or a respective one of the second terminal pads;
- and
- solder balls extending between, and bonded to, the first terminal pads and the second terminal pads, respective ones the solder balls extending into the at least one recess portion of respective ones of the first terminal pads and the at least one recess portion of respective ones of the second terminal pads.
An electronic system comprises microelectronic components in the form of:
- one or more input devices;
- one or more output devices;
- one or more microprocessor devices;
- one or more memory devices;
- and
- at least one substrate on which at least some of the one or more input devices, output devices, microprocessor devices or memory devices are mounted, the at least one substrate having terminal pads integral with and of a same thickness of associated conductive traces and respectively configured with an irregular surface topography comprising:
- at least one protruding portion of a same thickness as a thickness of a respectively associated conductive trace;
- at least one recess portion extending at least to a depth proximate a dielectric material.
A method of fabricating terminal pads on a substrate, the method comprising:
- blanket depositing a conductive material on a dielectric surface of a substrate;
- applying a photoresist over the conductive material;
- patterning the photoresist to define a pattern for conductive traces, terminal pads, and terminal pad surface topography on the conductive material;
- after patterning the photoresist, applying an etchant to the conductive material to form the conductive traces, the terminal pads, and the irregular surface topography on the terminal pads;
- and
- removing the etchant.
Dependencies are inferred from the claim text.