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US 2024/0258249 A1Published application
Semiconductor package member and semiconductor device
AssigneeRohm Co., Ltd.
InventorShunsuke Akasaka
Life of this patent
Estimating the term…
Abstract
Provided is a semiconductor package member including a substrate having a first main surface on which a recess is formed, in which the substrate includes a plurality of through holes formed in such a manner as to, from a first main surface, reach a second main surface opposite to the first main surface, and at least some of the plurality of through holes are formed at positions overlapping the recess.
Claims12
A semiconductor package member comprising:
- a substrate having a first main surface on which a recess is formed, wherein
- the substrate includes a plurality of through holes formed in such a manner as to, from a first main surface, reach a second main surface opposite to the first main surface, and
- at least some of the plurality of through holes are formed at positions overlapping the recess.
Dependencies are inferred from the claim text.