Semiconductor Device with Compartment Shield Formed from Metal Bars and Manufacturing Method Thereof
AssigneeSTATS ChipPAC Pte. Ltd.
InventorsYongKook Shin, KyoWang Koo, HeeYoun Kim, SeongKuk Kim
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Abstract
A semiconductor device has a substrate and first and second electrical component disposed over the substrate. A first metal bar is disposed over the substrate between the first electrical component and second electrical component. The first metal bar is formed by disposing a mask over a carrier. An opening is formed in the mask and a metal layer is sputtered over the mask. The mask is removed to leave the metal layer within the opening as the first metal bar. The first metal bar can be stored in a tape-and-reel.
Claims25
A method of making a semiconductor device, comprising:
- providing a substrate;
- disposing a first electrical component over the substrate;
- disposing a second electrical component over the substrate;
- and
- disposing a first metal bar over the substrate between the first electrical component and second electrical component.
A method of making a semiconductor device, comprising:
- providing an electrical component;
- and
- disposing a first metal bar adjacent to the electrical component.
A semiconductor device, comprising:
- a substrate;
- a first electrical component disposed over the substrate;
- a second electrical component disposed over the substrate;
- and
- a plurality of first metal bars disposed lined up over the substrate between the first electrical component and second electrical component.
A semiconductor device, comprising:
- a substrate;
- a first electrical component disposed over the substrate;
- a second electrical component disposed over the substrate;
- and
- a first metal bar disposed over the substrate between the first electrical component and second electrical component.
Dependencies are inferred from the claim text.