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US 2024/0258245 A1Published application
Molded module package with an emi shielding barrier
AssigneeTexas Instruments Incorporated
InventorsKWANG-SOO KIM, WOOCHAN KIM, VIVEK KISHORECHAND ARORA
Life of this patent
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Abstract
An electronic device that includes a substrate and a die disposed on the substrate, the die having an active surface. Wire bonds are attached from the active surface of the die to the substrate. A radiation barrier is attached to the substrate and disposed over the die. The radiation barrier is configured to mitigate electromagnetic radiation exposure to the die. A mold compound is formed over the die, the wire bonds, and the radiation barrier.
Claims20
An electronic device comprising:
- a substrate;
- a die having an active surface, the die being disposed on the substrate;
- wire bonds attached from the active surface of the die to the substrate;
- a radiation barrier attached to the substrate and disposed over the die, the radiation barrier configured to mitigate electromagnetic radiation exposure to the die;
- and
- a mold compound formed over the die, the wire bonds, and the radiation barrier.
3 more elements
A method of fabricating an electronic device comprising:
- providing a leadframe;
- depositing a die on the leadframe;
- attaching wire bonds from the die to the leadframe;
- placing a radiation barrier over the die, the radiation barrier configured to mitigate electromagnetic radiation exposure to the die;
- and
- forming a mold compound over the die, the wire bonds, and the radiation barrier.
3 more elements
Dependencies are inferred from the claim text.