Integrated circuit device
AssigneeSamsung Electronics Co., Ltd.
InventorsJuneyoung Park, Heonjong Shin, Jaeran Jang, Doohyun Lee
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Abstract
An integrated circuit device includes a first substrate having a first surface and a second surface opposite to the first surface, and including an active device therein, BEOL structure disposed on the first surface of the first substrate and configured to route signals, a second substrate disposed on the first surface of the first substrate with the first BEOL structure disposed therebetween, and including a passive device therein, a power distribution structure disposed on the second surface of the first substrate, a first bonding structure positioned on the first BEOL structure, and a second bonding structure disposed between the first bonding structure and the second substrate.
Claims20
An integrated circuit device comprising:
- a first substrate having a first surface and a second surface opposite to the first surface, and including an active device therein;
- a first back end of layer (BEOL) structure on the first surface of the first substrate and configured to route signals;
- a second substrate on the first surface of the first substrate with the first BEOL structure therebetween, and comprising a passive device therein;
- a power distribution structure on the second surface of the first substrate;
- a first bonding structure on the first BEOL structure;
- and
- a second bonding structure between the first bonding structure and the second substrate,
- wherein an upper surface of the second bonding structure contacts an upper surface of the first bonding structure to form an interface with the first bonding structure, and
- the second bonding structure and the first bonding structure are positioned between the first substrate and the second substrate.
An integrated circuit device comprising:
- a first bonding structure;
- a second bonding structure contacting an upper surface of the first bonding structure to form an interface;
- a first device region defined in one direction with respect to the upper surface;
- and
- a second device region defined in a direction opposite to the one direction with respect to the upper surface,
- wherein the first device region comprises:
- a first substrate having a first surface and a second surface opposite to the first surface, and comprising an active device therein;
- a first back end of layer (BEOL) structure on the first surface of the first substrate and configured to route signals;
- a power distribution structure on the second surface of the first substrate;
- and
- a through via passing through the first device region and the second bonding structure and configured to transfer an electrical signal to the second device region,
- wherein the second device region comprises a second substrate comprising a passive device, and
- the first substrate does not comprise the passive device.
An integrated circuit device comprising:
- a first bonding structure;
- a second bonding structure contacting an upper surface of the first bonding structure to form an interface;
- a first device region defined in one direction with respect to the upper surface;
- and
- a second device region defined in a direction opposite to the one direction with respect to the upper surface,
- wherein the first device region comprises
- a first substrate having a first surface and a second surface opposite to the first surface, and comprising an active device therein;
- a first back end of layer (BEOL) structure on the first surface of the first substrate, configured to route signals received from or transferred to the active device, and comprising first BEOL distribution patterns having different vertical levels and first BEOL vias between the first BEOL distribution patterns;
- a power distribution structure on the second surface of the first substrate and configured to supply power to the active device, comprising power distribution patterns having different vertical levels, and power distribution vias between the power distribution patterns;
- and
- a power pad below the power distribution structure and configured to supply power to the active device,
- wherein the second device region comprises a second substrate comprising a passive device therein and having a thickness smaller than a thickness of the first substrate in a direction perpendicular to an upper surface of the first substrate.
Dependencies are inferred from the claim text.