Circuit board and semiconductor package comprising same

A circuit board comprising:

• a first insulating layer including an upper and lower surface and a reinforcing member;
• a first through electrode passing through the upper and lower surfaces of the first insulating layer;
• and
• a first circuit pattern layer disposed on a lower surface of the first insulating layer,
• wherein the first through electrode includes:
• a first electrode part disposed adjacent to the lower surface of the first insulating layer and having a first inclination;
• and
• a second electrode part disposed adjacent to the upper surface of the first insulating layer and having a second inclination that is different from the first inclination so that a width gradually decreases toward the first upper surface of the first insulating layer,
• wherein the first inclination of the first electrode part non-overlaps in a horizontal direction with the first circuit pattern layer and the reinforcing member,
• wherein the second inclination of the first electrode part contacts the reinforcing member,
• wherein a thickness of the first electrode part is thinner than a thickness of the second electrode part, and
• wherein a width of an upper surface of the first electrode part satisfies a range between 95% and 105% of a width of a lower surface of the first electrode part.

A circuit board comprising:

• a core layer;
• a build-up insulating layer disposed on the core layer;
• a first through electrode passing through the core layer;
• and
• a second through electrode passing through the build-up insulating layer,
• wherein the first through electrode includes:
• a first through part disposed adjacent to an upper surface of the core layer and having a first inclination whose width gradually decreases toward a lower surface of the core layer;
• and
• a second through part disposed adjacent to the lower surface of the core layer and having a second inclination whose width gradually decreases toward the upper surface of the core layer,
• wherein the second through electrode includes:
• a third through part adjacent to a lower surface of the build-up insulating layer and having a third inclination such that the width gradually increases toward an upper surface of the build-up insulating layer;
• and
• a fourth through part disposed adjacent to the upper surface of the build-up insulating layer and having a fourth inclination different from the first to third inclinations, and
• wherein the build-up insulating layer includes a reinforcing member,
• wherein the third inclination of the third through part is in contact with the reinforcing member, and
• wherein a vertical length of the third inclination is greater than a vertical length of the fourth inclination.

A circuit board comprising:

• a plurality of insulating layers sequentially stacked along a vertical direction;
• and
• a plurality of through electrodes each disposed within the plurality of insulating layers,
• wherein the plurality of through electrodes has the same inclination,
• wherein each of the plurality of through electrodes includes:
• a first through part disposed adjacent to a lower surface of each insulating layer and having a first inclination;
• and
• a second through part disposed closer to an upper surface of each insulating layer than the first through part and having a second inclination different from the first inclination such that the width gradually decreases toward the upper surface of each insulating layer,
• wherein the second inclination is in contact with a reinforcing member provided in each insulating layer, and
• wherein a vertical length of the first inclination is greater than a vertical length of the second inclination.