Semiconductor package device and method for forming the same
AssigneeInnolux Corporation
InventorsCheng-Chi WANG, Kuan-Hsueh LIN, Shih-Kang LIN
Life of this patent
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Abstract
A semiconductor package device is provided. The semiconductor package device includes a circuit substrate having a first terminal end; a chip disposed on the circuit substrate and having a conductive pad; an auxiliary structure disposed between the first terminal end and the conductive pad, wherein the chip is electrically connected to the circuit substrate through the auxiliary structure; and a protective layer disposed on the circuit substrate and surrounding the chip, wherein the width of the first terminal end is greater than or equal to the width of the auxiliary structure.
Claims20
A semiconductor package device, comprising:
- a circuit substrate having a first terminal end;
- a chip disposed on the circuit substrate and having a conductive pad;
- an auxiliary structure disposed between the first terminal end and the conductive pad, wherein the chip is electrically connected to the circuit substrate through the auxiliary structure;
- and
- a protective layer disposed on the circuit substrate and surrounding the chip,
- wherein in a direction perpendicular to a normal direction of the semiconductor package device, the first terminal end has a first width, the auxiliary structure has a second width, and the first width is greater than or equal to the second width.
A method for forming a semiconductor package device, comprising:
- providing a circuit substrate and a chip;
- forming an auxiliary material pattern on the circuit substrate, the chip, or a combination thereof;
- forming an auxiliary structure between the circuit substrate and the chip;
- and
- forming a protective layer on the circuit substrate and surrounding the chip.
Dependencies are inferred from the claim text.