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US 2024/0258209 A1Published application
Semiconductor device
AssigneeMitsubishi Electric Corporation
InventorKazuo FUNAHASHI
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Abstract
A semiconductor device includes: a plurality of lead frames; a plurality of semiconductor elements mounted to the plurality of lead frames; a heat sink disposed below the plurality of lead frames; and an insulating sheet interposed between the plurality of lead frames and the heat sink. The insulating sheet and the heat sink are each divided into two or more portions, and all the plurality of semiconductor elements are arranged at positions overlapping the insulating sheet and the heat sink in plan view.
Claims10
A semiconductor device comprising:
- a plurality of lead frames;
- a plurality of semiconductor elements mounted to the plurality of lead frames;
- a heat sink disposed below the plurality of lead frames;
- and
- an insulating sheet interposed between the plurality of lead frames and the heat sink, wherein
- the insulating sheet and the heat sink are each divided into two or more portions, and
- all the plurality of semiconductor elements are arranged at positions overlapping the insulating sheet and the heat sink in plan view.
4 more elements
Dependencies are inferred from the claim text.