Semiconductor device

Abstract

A semiconductor device includes a semiconductor chip including a first principal surface in which an element region is formed and a peripheral end surface surrounding the first principal surface and an inspection wiring formed along the peripheral end surface on a side of the first principal surface of the semiconductor chip and that surrounds the element region, and, the inspection wiring includes a plurality of internal wiring portions that are formed at a surficial portion of the first principal surface of the semiconductor chip and that are arrayed at a distance from each other along the peripheral end surface of the semiconductor chip and a extending wiring portion that is formed on the first principal surface of the semiconductor chip and that is provided between the internal wiring portions adjoining each other, and the internal wiring portion and the extending wiring portion are alternately arrayed along the peripheral end surface.

Dependencies are inferred from the claim text.