Lead frame assembly for a semiconductor device
AssigneeNexperia B.V.
InventorsRicardo Yandoc, Dave Anderson, Adam Brown
Life of this patent
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Abstract
This disclosure relates to a lead frame assembly for a semiconductor device, a semiconductor device and an associated method of manufacture. The lead frame assembly includes a die attach structure and a clip frame structure. The clip frame structure includes a die connection portion configured to contact a contact terminal on a top side of the semiconductor die; and a continuous lead portion extending along the die connection portion. The continuous lead portion is integrally formed with the die connection portion.
Claims20
A lead frame assembly for a semiconductor device, the lead frame assembly comprising:
- a die attach structure and a clip frame structure, the clip frame structure comprising:
- a die connection portion configured for contacting a contact terminal on a top side of the semiconductor die;
- and
- a continuous lead portion extending along the die connection portion, wherein the continuous lead portion is integrally formed with the die connection portion, and
- wherein the die attach structure provides a bottom external lead to a bottom contact terminal on a bottom side of the semiconductor die and includes a number of slots or holes formed through the die connection portion and the bottom external lead.
A semiconductor device, comprising:
- a semiconductor die comprising a top side and a bottom side;
- a top contact terminal on the top side of the semiconductor die;
- and
- a bottom contact terminal on the bottom side of the semiconductor die;
- a lead assembly comprising:
- a die attach structure and a clip frame structure, the clip frame structure comprising:
- a die connection portion configured for contacting the contact terminal on the top side of the semiconductor die;
- and
- a continuous lead portion extending along the die connection portion, wherein the continuous lead portion is integrally formed with the die connection portion, and
- wherein the die attach structure provides a bottom external lead to the bottom contact terminal on the semiconductor die and includes a number of slots or holes formed through the die connection portion and the bottom external lead.
A method of manufacturing a semiconductor device, the method comprising:
- providing a lead frame assembly;
- mounting a semiconductor die on a die attach structure of the lead frame assembly;
- providing a clip frame structure, the clip frame structure comprising:
- a die connection portion configured to contacting a contact terminal on a top side of the semiconductor die;
- and
- a continuous lead portion extending along the die connection portion, wherein the continuous lead is portion integrally formed with the die connection portion,
- wherein the die attach structure provides a bottom external lead to a bottom contact terminal arranged on the semiconductor die and includes a number of slots or holes formed through the die connection portion and the bottom external lead.
Dependencies are inferred from the claim text.