Heat dissipation devices
AssigneeThero New Material Technology Co., Ltd
InventorsXin NIE, Ruohan YANG, Yongheng WANG
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Abstract
A heat dissipation device includes a phase-change accumulator, a water cooler, and a heat conduction cavity. The water cooler comprises a heat absorption mechanism. A top and a bottom of the heat absorption mechanism are fixedly mounted respectively to the phase-change accumulator and the heat conduction cavity. The heat conduction cavity is made of red copper and is attachable to a CPU. The heat conduction cavity is filled with water, and a ratio of a volume of the water within the heat conduction cavity to a volume of the heat conduction cavity is 0.2˜0.9. The phase-change accumulator is filled with a phase-change material.
Claims9
A heat dissipation device, comprising a phase-change accumulator, a water cooler, and a heat conduction cavity,
- wherein the water cooler comprises a heat absorption mechanism, a top and a bottom of the heat absorption mechanism being fixedly mounted respectively to the phase-change accumulator and the heat conduction cavity;
- the heat conduction cavity is made of red copper and is attachable to a CPU, and the heat conduction cavity is filled with water, a ratio of a volume of the water within the heat conduction cavity to a volume of the heat conduction cavity being 0.2˜0.9;
- and
- the phase-change accumulator is filled with a phase-change material.
Dependencies are inferred from the claim text.