Inverter power module
AssigneeAmosense Co., Ltd.
InventorsKyungwhan WOO, Seunggon PARK
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Abstract
The present disclosure relates to an inverter power module, and includes a ceramic substrate (110), an LTCC substrate (120) disposed to be spaced apart from an upper portion of the ceramic substrate (110), and a semiconductor chip (130) having a lower surface bonded to a metal pattern (112) on an upper surface of the ceramic substrate (110) and an upper surface bonded to an external electrode (123) of the LTCC substrate (120). The present disclosure has the advantage of being able to provide an inverter power module with more improved functions and operational reliability by using a ceramic substrate and an LTCC substrate.
Claims17
An inverter power module comprising:
- a ceramic substrate;
- an LTCC substrate disposed to be spaced apart from an upper portion of the ceramic substrate;
- and
- a semiconductor chip having a lower surface bonded to a metal pattern on an upper surface of the ceramic substrate and an upper surface bonded to an external electrode of the LTCC substrate.
An inverter power module comprising:
- a lower ceramic substrate;
- an upper ceramic substrate disposed to be spaced apart from an upper portion of the lower ceramic substrate;
- a semiconductor chip bonded to a metal pattern on an upper surface of the lower ceramic substrate;
- and
- a conductive spacer installed between the semiconductor chip and the upper ceramic substrate to connect a signal transfer electrode on an upper surface of the semiconductor chip and a metal pattern of the upper ceramic substrate.
Dependencies are inferred from the claim text.