Power electronic device assemblies having an electrically insulating s-cell
AssigneeToyota Motor Engineering & Manufacturing North America, Inc.
InventorsFeng Zhou, Tianzhu Fan
Life of this patent
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Abstract
In one embodiment, a power electronics assembly includes a power device assembly further including an S-cell. The S-cell includes a first metal layer having a recess, a graphite layer bonded to the first metal layer, a second metal layer bonded to the graphite layer, and a ceramic layer, wherein the ceramic layer has a first metalized surface and a second metalized surface, and the first metalized surface is bonded to the second metal layer by a solder layer. The power electronics assembly further includes a power device disposed within the recess of the first metal layer, and a cold plate, wherein the second metalized surface of the ceramic layer is bonded to a surface of the cold plate.
Claims20
A power electronics assembly comprising:
- a power device assembly comprising:
- an S-cell comprising:
- a first metal layer comprising a recess;
- a graphite layer bonded to the first metal layer;
- a second metal layer bonded to the graphite layer;
- and
- a ceramic layer, wherein the ceramic layer comprises a first metalized surface and a second metalized surface, and the first metalized surface is bonded to the second metal layer by a solder layer;
- a power device disposed within the recess of the first metal layer;
- and
- a cold plate, wherein the second metalized surface of the ceramic layer is bonded to a surface of the cold plate.
A power electronics assembly comprising:
- a power device assembly comprising:
- an S-cell comprising:
- a first metal layer comprising a recess;
- a first graphite layer bonded to the first metal layer;
- a ceramic layer comprising a first metalized surface and a second metalized surface, wherein the first metalized surface is bonded to the first graphite layer;
- a second graphite layer bonded to the second metalized surface of the ceramic layer;
- a second metal layer bonded to the second graphite layer;
- and
- a power device disposed within the recess of the surface;
- and
- a cold plate, wherein the second metal layer is bonded to a surface of the cold plate.
A method of fabricating a power electronics device assembly, the method comprising:
- fabricating one or more power device assemblies by:
- bonding a first metal layer to a first surface of a graphite layer;
- bonding a second metal layer to a second surface of the graphite layer;
- bonding the second metal layer to a first metalized surface of a ceramic layer;
- forming a recess within the first metal layer;
- and
- disposing a power device within the recess.
Dependencies are inferred from the claim text.