Floating heat spreader with guided mechanism

A chip package, comprising:

• a substrate;
• an integrated circuit (“IC”) die mounted to the substrate;
• a thermal interface material (TIM) disposed above the IC dies;
• a stiffener frame mounted to the substrate and having a plurality of connected walls circumscribing the IC die;
• and
• a lid having a bottom side facing a top surface of the IC die, the lid having at least a first guide and a second guide extending from the bottom side of the lid, the first guide and the second guide positioned to limit movement of the lid relative to the stiffener frame in two directions.

A method of fabricating a chip package, comprising:

• forming a first guide and a second guide on a bottom surface of a lid;
• disposing the lid above a stiffener frame, the first guide positioned inward or outward of a wall of the stiffener frame;
• and
• moving the first guide toward the wall of the stiffener frame.