Semiconductor device

Abstract

There is provided a semiconductor device 1, comprising: a housing comprising a first housing electrode 5 and a second housing electrode 4 which are arranged at opposite sides of the housing, wherein the first housing electrode 5 comprises an electrode plate; and a plurality of semiconductor units 30 arranged within the housing between the first and second housing electrodes 4, 5 and coupled to at least one of the first and second housing electrodes by pressure; a thermal coupler 17 arranged within the housing between the plurality of semiconductor units 30 and the electrode plate of the first housing electrode 5; a first array of pillars 10 extending between the plurality of semiconductor units 30 and the thermal coupler 17, and electrically coupled to the plurality of semiconductor units 30, respectively; and a second array of pillars 18 extending between the thermal coupler 17 and the electrode plate of the first housing electrode 5, wherein the first array of pillars 10 are electrically coupled to the electrode plate via the second arrays of pillars 18; wherein the thermal coupler 17 is configured to extend between at least some of the first array of pillars 10 so as to thermally couple the at least some of the first array of pillars 10 to one another.

Dependencies are inferred from the claim text.