Semiconductor device
AssigneeMitsubishi Electric Corporation
InventorsShoji SAITO, Seiichiro INOKUCHI, Taishi SASAKI, Hiroya SANNAI
Life of this patent
Estimating the term…
Abstract
An object is to provide a technique capable of suppressing a crack that reaches a semiconductor element. A semiconductor device includes a semiconductor element, a lead electrode terminal, a first sealing member, and an intervening member. The lead electrode terminal has an extending portion separated from an upper surface of the semiconductor element, and is bonded to the semiconductor element. The first sealing member seals the lead electrode terminal. The intervening member is provided between an end portion of the extending portion in an extending direction and the semiconductor element. The intervening member has an interface with the first sealing member under the end portion.
Claims13
A semiconductor device comprising:
- a semiconductor element;
- a lead electrode terminal having an extending portion separated from an upper surface of the semiconductor element and bonded to the semiconductor element;
- a first sealing member that seals the lead electrode terminal;
- and
- an intervening member provided between an end portion of the extending portion in an extending direction and the semiconductor element, the intervening member having an interface with the first sealing member under the end portion.
A semiconductor device comprising:
- a semiconductor element;
- a lead electrode terminal having an extending portion separated from an upper surface of the semiconductor element and bonded to the semiconductor element;
- and
- a sealing member that seals the semiconductor element and the lead electrode terminal, wherein
- a distance between the semiconductor element and the extending portion is equal to or more than a thickness of the extending portion.
Dependencies are inferred from the claim text.