Semiconductor device

A semiconductor device comprising:

• a semiconductor element;
• a conductive member including a die pad portion, a first terminal portion, and a second terminal portion;
• and
• a sealing resin covering a portion of the conductive member and the semiconductor element,
• wherein the sealing resin includes a first resin surface facing in a first sense of a thickness direction of the sealing resin, a second resin surface facing in a second sense of the thickness direction, a third resin surface facing in a first sense of a first direction perpendicular to the thickness direction, and a fourth resin surface facing in a second sense of the first direction,
• the die pad portion includes:
• a mounting surface facing in the first sense of the thickness direction and on which the semiconductor element is mounted;
• and an exposed surface facing in the second sense of the thickness direction and exposed from the second resin surface,
• the first terminal portion is bent toward a side in the first sense of the thickness direction and exposed from the third resin surface,
• the second terminal portion is bent toward the side in the first sense of the thickness direction and exposed from the fourth resin surface,
• the first resin surface includes a recessed region recessed in the thickness direction toward the second resin surface, and
• the recessed region overlaps with an imaginary line connecting the first terminal portion and the second terminal portion as viewed in the thickness direction.