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US 2024/0258185 A1Published application
Warpage control of packages using embedded core frame
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu
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Abstract
A method includes placing a package component over a carrier. The package component includes a device die. A core frame is placed over the carrier. The core frame forms a ring encircling the package component. The method further includes encapsulating the core frame and the package component in an encapsulant, forming redistribution lines over the core frame and the package component, and forming electrical connectors over and electrically coupling to the package component through the redistribution lines.
Claims20
A package comprising:
- a package component comprising a device die therein;
- a core frame comprising a first portion and a second portion on opposite sides of the package component;
- a plurality of dielectric layers over the core frame;
- and
- redistribution lines in the plurality of dielectric layers, wherein the redistribution lines are electrically connected to the package component, and are electrically decoupled from the core frame.
2 more elements
A package comprising:
- a package component comprising a device die therein;
- a core frame forming a ring encircling the package component, wherein the core frame comprises a dielectric core;
- an encapsulant, wherein the package component and the core frame are in the encapsulant, and wherein the dielectric core of the core frame is in physical contact with the encapsulant;
- a plurality of dielectric layers over the encapsulant;
- and
- redistribution lines in the plurality of dielectric layers, wherein the redistribution lines are electrically connected to the package component.
3 more elements
A package comprising:
- a package component comprising a device die therein;
- a core frame forming a ring encircling the package component;
- a molding compound, wherein both of the package component and the core frame are in the molding compound, and wherein the molding compound comprises a first portion encircling the core frame;
- a plurality of dielectric layers over the molding compound;
- and
- redistribution lines in the plurality of dielectric layers, wherein the redistribution lines are electrically connected to the package component, and are electrically decoupled from the core frame.
3 more elements
Dependencies are inferred from the claim text.