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US 2024/0258184 A1Published application
Package for an integrated circuit and manufacturing method
AssigneeSTMicroelectronics (Grenoble 2) SAS
InventorJerome LOPEZ
Life of this patent
Estimating the term…
Abstract
An encapsulation hood is fastened onto electrically conductive zones of a support substrate using springs. Each spring has a region in contact with an electrically conductive path contained in the encapsulation hood and another region in contact with a corresponding one of the electrically conductive zones. The fastening of the part of the encapsulation hood onto the support substrate compresses the springs and further utilizes a bead of insulating glue located between the compressed springs.
Claims12
A package, comprising:
- a support substrate having a mounting face including a first electrical zone and a second electrical zone;
- an electronic chip mounted to the mounting face;
- an encapsulation hood including an electrically conductive path extending from a first end to a second end, said first and second ends located at a bottom edge of the encapsulation hood;
- wherein a bottom edge of the encapsulation hood faces the mounting face of the support substrate;
- a spot of conductive glue covering each of the first and second electrical zones;
- a first electrically conductive spring having a U-shaped cross-section with a first leg secured by the spot of glue at the first electrical zone and a second leg in contact with the first end of the electrically conductive path at the bottom edge of the encapsulation hood;
- and
- a second electrically conductive spring having a U-shaped cross-section with a first leg secured by the spot of glue at the second electrical zone and a second leg in contact with the second end of the electrically conductive path at the bottom edge of the encapsulation hood.
5 more elements
A package, comprising:
- a support substrate having a mounting face including a first electrical zone and a second electrical zone;
- an electronic chip mounted to the mounting face;
- an encapsulation hood including an electrically conductive path extending from a first end to a second end, said first and second ends located at a bottom edge of the encapsulation hood;
- wherein a bottom edge of the encapsulation hood faces the mounting face of the support substrate;
- a spot of conductive glue covering each of the first and second ends;
- a first electrically conductive spring having a U-shaped cross-section with a first leg secured by the spot of glue at the first end of the electrically conductive path at the bottom edge of the encapsulation hood and a second leg in contact with the first electrical zone of the support substrate;
- and
- a second electrically conductive spring having a U-shaped cross-section with a first leg secured by the spot of glue at the second end of the electrically conductive path at the bottom edge of the encapsulation hood and a second leg in contact with the second electrical zone of the support substrate.
5 more elements
A package, comprising:
- a support substrate having a mounting face including a first electrical zone and a second electrical zone;
- an electronic chip mounted to the mounting face;
- an encapsulation hood including an electrically conductive path extending from a first end to a second end, said first and second ends located at a bottom edge of the encapsulation hood;
- wherein a bottom edge of the encapsulation hood faces the mounting face of the support substrate;
- a first electrically conductive spring having a first spring end in contact with the first electrical zone and a second spring end in contact with the first connection of the electrically conductive path at the bottom edge of the encapsulation hood;
- a second electrically conductive spring having a first spring end in contact with the second electrical zone and a second spring end in contact with the second connection of the electrically conductive path;
- and
- a spot of conductive glue at one of the first or second spring ends of each of the first and second electrically conductive springs.
5 more elements
Dependencies are inferred from the claim text.