Protruding sn substrate features for epoxy flow control

An electronic system, comprising:

• a board;
• an electronic package electrically coupled to the board, wherein the electronic package comprises:
• a package substrate;
• a plurality of interconnects on the package substrate;
• a die coupled to the package substrate by the plurality of interconnects, the die having a footprint;
• a feature on the package substrate, wherein the feature is electrically isolated from circuitry of the electronic package, wherein the feature comprises a plurality of substantially parallel lines, and wherein the feature is continuous from a location within the footprint of the die to a location outside of the footprint of the die;
• and
• an underfill surrounding the plurality of interconnects and in contact with the feature.