US 2024/0258180 A1 · SEMICONDUCTOR DEVICE INCLUDING CRACK DETECTION CIRCUIT

Abstract

A semiconductor device includes a first semiconductor chip; a second semiconductor chip stacked on the first semiconductor chip, wherein a type of the second semiconductor chip is different from a type of the first semiconductor chip; and a crack detection circuit including: a first crack detection line repeatedly passing through an interface between the first semiconductor chip and the second semiconductor chip; a second crack detection line including a bonding pad or a through-via structure contacting a surface of the second semiconductor chip opposite to the interface; and a crack detector in the second semiconductor chip, the crack detector being configured to output a first test signal to the first crack detection line, receive a first reception signal from the first crack detection line, output a second test signal to the second crack detection line, and receive a second reception signal from the second crack detection line.

Claims20

Dependent claims

A semiconductor device comprising:

a first semiconductor chip;
a second semiconductor chip stacked on the first semiconductor chip, wherein a type of the second semiconductor chip is different from a type of the first semiconductor chip;
and
a crack detection circuit comprising:
a first crack detection line repeatedly passing through an interface between the first semiconductor chip and the second semiconductor chip;
a second crack detection line comprising a bonding pad or a through-via structure contacting a surface of the second semiconductor chip opposite to the interface;
and
a crack detector in the second semiconductor chip, the crack detector being configured to:
output a first test signal to the first crack detection line,
receive a first reception signal from the first crack detection line,
output a second test signal to the second crack detection line, and
receive a second reception signal from the second crack detection line.

9 more elements

A semiconductor device comprising:

a first semiconductor chip including a memory cell array;
a second semiconductor chip provided under the first semiconductor chip and comprising a peripheral circuit;
and
a crack detection circuit comprising:
a first crack detection line repeatedly passing through an interface between the first semiconductor chip and the second semiconductor chip;
a second crack detection line comprising a bonding pad contacting a surface of the first semiconductor chip opposite to the interface;
and
a crack detector in the second semiconductor chip, the crack detector being configured to:
output a first test signal to the first crack detection line,
receive a first reception signal from the first crack detection line,
output a second test signal to the second crack detection line, and
receive a second reception signal from the second crack detection line.

9 more elements

A semiconductor device comprising:

a first semiconductor chip;
a second semiconductor chip, each of the first semiconductor chip and the second semiconductor chip comprises a memory cell array;
a third semiconductor chip stacked under the second semiconductor chip and comprising a peripheral circuit;
and
a crack detection circuit comprising:
a first crack detection line that repeatedly passes through an interface between the first semiconductor chip and the second semiconductor chip;
a second crack detection line that repeatedly passes through an interface between the second semiconductor chip and the third semiconductor chip;
and
a crack detector in the third semiconductor chip, the crack detector being configured to:
output a first test signal to the first crack detection line,
receive a first reception signal from the first crack detection line,
output a second test signal to the second crack detection line, and
receive a second reception signal from the second crack detection line.

10 more elements

Dependencies are inferred from the claim text.

Semiconductor device including crack detection circuit

Life of this patent

Semiconductor device including crack detection circuit

Life of this patent

Abstract

Claims20