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US 2024/0258173 A1Published application
Semiconductor device
AssigneeMitsuboshi Diamond Industrial Co., Ltd.
InventorsMitsuru KITAICHI, Yoshiyuki ASAI, Masakazu TAKEDA
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Abstract
A semiconductor device includes a semiconductor layer (2) composed of a single crystal. The semiconductor device comprises a mounted surface on which an element is mounted, a non-mounted surface opposed to the mounted surface, and a compressive stress field in an outer peripheral region on at least one of the mounted surface and the non-mounted surface.
Claims13
A semiconductor device including a semiconductor layer composed of a single crystal, comprising:
- a mounted surface on which an element is mounted;
- a non-mounted surface opposed to the mounted surface;
- and
- a compressive stress field in an outer peripheral region on at least one of the mounted surface and the non-mounted surface.
1 more element
Dependencies are inferred from the claim text.