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US 2024/0258153 A1Published application
Apparatus and methods for semiconductor processing
AssigneeApplied Materials, Inc.
InventorsJoseph Yudovsky, Kaushal Gangakhedkar
Life of this patent
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Abstract
Described are apparatus and methods for processing a semiconductor wafer so that the wafer remains in place during processing. The wafer is subjected to a pressure differential between the top surface and bottom surface so that sufficient force prevents the wafer from moving during processing, the pressure differential generated by applying a decreased pressure to the back side of the wafer.
Claims25
A susceptor for a processing chamber, the susceptor comprising:
- a susceptor top surface;
- a susceptor bottom surface;
- a plurality of recesses in the susceptor top surface to support a plurality of wafers, the plurality of recesses positioned so that central axes of the plurality of wafers are offset from a central axis of the susceptor, when the wafers are supported by the recesses, each of the plurality of recesses having a bottom surface;
- and
- at least one passage extending between the bottom surface of at least one of the plurality of recesses and the susceptor bottom surface,
- at least one hole extending from a surface of the susceptor to the at least one passage;
- and
- at least one plug that seals the at least one hole.
5 more elements
Dependencies are inferred from the claim text.