Method for manufacturing electronic device

A method for manufacturing an electronic device, the method at least comprising:

• a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer;
• a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side;
• and
• a step (C) of irradiating the adhesive film with an ultraviolet ray and then removing the adhesive film from the wafer,
• wherein the adhesive film includes a base material layer, and an adhesive resin layer configured with an ultraviolet curable adhesive resin material, provided on one surface side of the base material layer, and
• in the step (C), regarding the adhesive resin layer of the adhesive film after being irradiated with an ultraviolet ray, when a storage elastic modulus at −15° C. measured under the following conditions is defined as E′ (−15° C.) and a storage elastic modulus at 100° C. is defined as E′ (100° C.),
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• (Conditions)
• a dynamic viscoelasticity is measured at a frequency of 1 Hz and a temperature of −50° C. to 200° ° C. in a tensile mode.