Substrate processing system

A substrate processing system that continuously performs batch processing of collectively processing a plurality of substrates and single-wafer processing of processing the substrates one by one, the substrate processing system comprising:

• a batch processing apparatus configured to perform batch processing;
• at least one single-wafer processing apparatus configured to perform single-wafer processing on a batch-processed substrate;
• and
• at least one relay apparatus in which two positions are defined, one being a carry-in position for receiving the batch-processed substrate from the batch processing apparatus, and the other being a carry-out position for transferring the substrate received at the carry-in position to the single-wafer processing apparatus,
• wherein the batch processing apparatus includes:
• a first carrier placement shelf on which a carrier is placed, the carrier accommodating a plurality of substrates in a horizontal attitude at a predetermined interval in a vertical direction;
• a transfer block adjacent to the first carrier placement shelf, and a batch processing block adjacent to the transfer block,
• the transfer block includes:
• a substrate handling mechanism configured to collectively take out the plurality of substrates from the carrier placed on the first carrier placement shelf, and
• a first attitude changing mechanism configured to collectively change the plurality of substrates taken out from the carrier from the horizontal attitude to a vertical attitude,
• the batch processing block includes:
• at least one batch processing bath in which the plurality of substrates in the vertical attitude are collectively immersed;
• and
• a collective conveyance mechanism configured to collectively convey the plurality of substrates in the vertical attitude among the transfer block, the batch processing bath, and the carry-in position of the relay apparatus,
• the single-wafer processing apparatus includes:
• a second carrier placement shelf on which the carrier is placed;
• an indexer block adjacent to the second carrier placement shelf, and a single-wafer processing block adjacent to the indexer block,
• the single-wafer processing block includes:
• a plurality of single-wafer processing chambers configured to perform a drying treatment on the substrates in a horizontal attitude one by one;
• and
• a single-wafer conveyance mechanism configured to receive the batch-processed substrates in the horizontal attitude one by one from the carry-out position of the relay apparatus and convey the substrates to the single-wafer processing chambers,
• the indexer block includes an indexer robot configured to allow the single-wafer-processed substrates to be accommodated in the carrier placed on the second carrier placement shelf, and
• the relay apparatus includes:
• a second attitude changing mechanism configured to change the plurality of substrates received from the batch processing apparatus from the vertical attitude to the horizontal attitude;
• and
• a relay conveyance mechanism configured to convey the substrates along a substrate conveyance path provided between the carry-in position and the carry-out position.