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US 2024/0258145 A1Published application
Semiconductor wafer processing system and method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsKai-Hung HSIAO, Chi-Chung JEN, Yu-Chun SHEN, Jhang-Jie JIAN, Wen-Chih CHIANG
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Abstract
A semiconductor wafer processing system includes a stocker having an interior surface, a wafer carrier disposed within the stocker, a wafer shelf disposed within the wafer carrier for storing a semiconductor wafer, and a discharge circuit including a first conductor electrically coupled to the wafer shelf and a first current controller electrically coupled to the first conductor and to the interior surface of the stocker.
Claims3
A method, comprising:
- detecting whether a first charge at a conductor electrically coupled to a wafer shelf of a wafer carrier is greater than a second charge at a stocker contact of a discharge circuit;
- and
- closing a conductive path from the conductor to the stocker contact if the first charge is greater than the second charge.
Dependencies are inferred from the claim text.