Methods and apparatus for calibration of substrate processing chamber placement via imaging
AssigneeApplied Materials, Inc.
InventorsZhepeng CONG, Tao SHENG, Nimrod SMITH, Khokan C. PAUL, Vinh N. TRAN, Awse MA'AYA
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Abstract
An apparatus, method, and system for calibrating substrate positioning and placement on a substrate support in a process chamber via imaging. In an embodiment, a calibrating substrate is provided. The calibrating substrate generally includes a top surface having a plurality of first marking features and a at least one edge marking feature configured to be detectable relative to the remaining portions of the top surface of the body by an imaging apparatus.
Claims20
A method for calibrating substrate placement in a process chamber, comprising:
- placing a calibrating substrate using a transfer robot on a substrate support disposed in a process chamber, wherein the calibrating substrate comprises a plurality of marking features and at least one edge marking feature on a top surface of the calibrating substrate, wherein the plurality of marking features and the at least one edge marking feature are configured to be detectable by an imaging apparatus coupled to the process chamber, and wherein the at least one edge marking feature is disposed along a circumference of the calibrating substrate;
- capturing one or more images of the calibrating substrate and the substrate support using the imaging apparatus;
- determining from the one or more images a center of the substrate support using one or more predefined features disposed at predetermined locations on the substrate support;
- and
- determining from the one or more images a true center of the calibrating substrate using the plurality of marking features on the calibrating substrate and the predetermined locations of the one or more predefined features on the substrate support.
A calibrating substrate for use in a process chamber, comprising:
- a circular body having a top surface and a circumference;
- a plurality of first marking features disposed on the top surface of the body;
- and
- at least one edge marking feature disposed on the top surface of the body and along the circumference of the calibrating substrate;
- wherein the plurality of first marking features and the at least one edge marking feature are configured to be detectable relative to the remaining portions of the top surface of the body by an imaging apparatus.
A processing system for analyzing a calibrating substrate in a process chamber, comprising:
- a process chamber having a processing volume;
- a substrate support disposed in the processing volume, the substrate support configured to receive a substrate;
- a calibrating substrate placed on the substrate support by a transfer robot, the calibrating substrate comprises:
- a circular body having a top surface and a circumference;
- a plurality of first marking features disposed on the top surface of the body;
- and
- at least one edge marking feature disposed on the top surface of the body and extending along a portion of the circumference;
- and
- wherein the plurality of first marking features and the at least one edge marking feature are configured to be detectable relative to the remaining portions of the top surface of the body by an imaging apparatus;
- and
- wherein the imaging apparatus is coupled to the process chamber and connected to a controller, the controller comprising instructions that, when executed, cause:
- the imaging apparatus to capture one or more images the calibrating substrate and the substrate support, the one or more images showing a plurality of marking features on the calibrating substrate relative to one or more predefined features on the substrate support, the one or more predefined features being disposed at predetermined locations on the substrate support;
- and
- a processor to determine a true center of the calibrating substrate and a center of the substrate support using the one or more images.
Dependencies are inferred from the claim text.