Methods and systems for temperature control for a substrate

An apparatus comprising:

• a direct current (DC) power source operatively coupled to heating elements embedded in at least one of a plurality of zones of a substrate support assembly;
• and
• a controller operatively coupled to the heating element and to the DC power source, wherein the controller is to:
• cause a direct current (DC) power to be supplied to a heating element embedded into a substrate support assembly;
• measure a voltage across the heating element and a current through the heating element as the DC power is supplied to the heating element;
• determine a resistance of the heating element based on the measured voltage and the measured current;
• obtain a temperature measurement for at least one of the heating element or a zone that includes the heating element as the DC power is supplied to the heating element, wherein the temperature measurement is obtained based on one or more signals of a temperature sensor;
• update a temperature model based on the determined resistance of the heating element and the obtained temperature measurement;
• and
• control, based on the updated temperature model and during a substrate process, a temperature of at least one of:
• the heating element embedded in a substrate support assembly, or
• an additional heating element embedded in the substrate support assembly or embedded in an additional substrate support assembly.

An electronics device manufacturing system comprising:

• a processing chamber comprising a substrate support assembly, the substrate support assembly comprising heating elements embedded into at least one of a plurality of zones of the substrate support assembly;
• a direct current (DC) power source configured to supply DC power to each heating element;
• and
• a controller operatively coupled to each heating element, the DC power source, wherein the controller is to:
• cause a direct current (DC) power to be supplied to a heating element embedded into a substrate support assembly;
• measure a voltage across the heating element and a current through the heating element as the DC power is supplied to the heating element;
• determine a resistance of the heating element based on the measured voltage and the measured current;
• obtain a temperature measurement for at least one of the heating element or a zone that includes the heating element as the DC power is supplied to the heating element, wherein the temperature measurement is obtained based on one or more signals of a temperature sensor;
• update a temperature model based on the determined resistance of the heating element and the obtained temperature measurement;
• and
• control, based on the updated temperature model and during a substrate process, a temperature of at least one of:
• the heating element embedded in a substrate support assembly, or
• an additional heating element embedded in the substrate support assembly or embedded in an additional substrate support assembly.