Semiconductor processing tool platform configuration with reduced footprint

A mainframe for a semiconductor manufacturing device comprising:

• a transfer chamber of heptagonal shape and comprising:
• a bottom;
• four first facets, wherein each of the first four facets is adapted for attachment to a processing chamber;
• two second facets, wherein each of the two second facets has a width that is narrower than that of each of the four first facets and is adapted for attachment to an auxiliary chamber that is smaller than the processing chambers;
• a single third facet, wherein the single third facet is adapted for attachment to a load lock, and wherein the single third facet is positioned between the two second facets and also has a width that is narrower than that of each of the four first facets;
• and
• a robot attached to the bottom, the robot adapted to transfer substrates to and from the processing chamber, the auxiliary chamber, and the load lock.

A method of operating a substrate processing system comprising a factory interface having a controlled environment and a factory interface robot;

• a transfer chamber comprising four first facets and three second facets, where each of the three second facets has a width that is narrower than that of each of the four first facets;
• a first processing chamber attached to a first of the four first facets;
• a first auxiliary chamber attached to a first of the three second facets;
• a load lock attached to a second of the three second facets and to the factory interface;
• a second auxiliary chamber attached to a third of the three second facets, wherein the load lock is attached to the transfer chamber between the first and second auxiliary chambers;
• and a transfer chamber robot attached to a bottom of the transfer chamber, the method comprising:
• causing the factory interface robot to transfer a substrate from the factory interface to the load lock;
• causing the transfer chamber robot to transfer the substrate from the load lock to the first auxiliary chamber;
• causing the transfer chamber robot to transfer the substrate from the first auxiliary chamber to the first processing chamber;
• causing the transfer chamber robot to transfer the substrate from the first processing chamber to the second auxiliary chamber;
• and
• causing the transfer chamber robot to transfer the substrate from the second auxiliary chamber to the load lock.