Electronic package, electronic structure and manufacturing method thereof
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsYi-Ling CHEN, Kuan-Wei CHUANG
Life of this patent
Estimating the term…
Abstract
An electronic structure is provided, in which a plurality of conductors are disposed on one surface of an electronic body, an epoxy molding compound is used as a protective layer to encapsulate the plurality of conductors, a circuit portion is bonded onto the other surface of the electronic body, and a plurality of external bumps and solder material are formed on the circuit portion. Therefore, with the design of the protective layer, heat energy can be effectively transferred from the protective layer to the solder material below during a process of heating the electronic structure so as to avoid a problem of non-wetting of the solder material.
Claims17
An electronic structure, comprising:
- an electronic body;
- a plurality of conductors disposed on one surface of the electronic body;
- a protective layer formed on the electronic body and covering the plurality of conductors, wherein the protective layer is made of an epoxy molding compound;
- a circuit portion bonded onto the other surface of the electronic body;
- a plurality of external bumps formed on and electrically connected to the circuit portion;
- a solder material formed on each of the plurality of external bumps;
- and
- a bonding layer formed on the circuit portion and covering the plurality of external bumps and the solder material.
A method of manufacturing an electronic structure, comprising:
- providing an electronic body with a plurality of conductors disposed on one surface of the electronic body and a circuit portion bonded onto the other surface of the electronic body;
- forming a plurality of external bumps on the circuit portion, wherein the plurality of external bumps are electrically connected to the circuit portion, and a solder material is formed on each of the plurality of external bumps;
- forming a bonding layer on the circuit portion to cover the plurality of external bumps and the solder material;
- forming an epoxy molding compound on the electronic body to cover the plurality of conductors;
- thermosetting the epoxy molding compound;
- and
- polishing the epoxy molding compound to form a protective layer.
Dependencies are inferred from the claim text.