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US 2024/0258111 A1Published application
Surface Treatment Compositions and Methods
AssigneeFujifilm Electronic Materials U.S.A., Inc.
InventorsWilliam A. Wojtczak, Kazutaka Takahashi, Atsushi Mizutani, Keeyoung Park
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Abstract
This disclosure relates to methods and compositions for treating a wafer having a pattern disposed on a surface of the wafer.
Claims25
A method for treating a semiconductor substrate having a pattern disposed on a surface of a wafer, comprising:
- contacting the surface with a surface treatment composition to form a surface treatment layer such that the surface treatment layer has a water contact angle of at least about 50 degrees, the surface treatment composition comprising at least one solvent and at least one trialkylsilyl compound selected from the group consisting of trialkylsilyl alkylsulfonates, trialkylsilyl arylsulfonates, and trialkylsilyl acetates;
- wherein the surface treatment composition is substantially free of propylene glycol methyl ether acetate and is substantially free of an additional Si-containing compound other than the at least one trialkylsilyl compound, and the pattern comprises a feature having a dimension of at most about 20 nm.
-6. (canceled)
-18. (canceled)
A surface treatment composition, comprising:
- at least one trialkylsilyl compound in an amount of from about 0.1 wt % to about 15 wt % of the surface treatment composition, the at least one trialkylsilyl compound being selected from the group consisting of trialkylsilyl alkylsulfonates, trialkylsilyl arylsulfonates, and trialkylsilyl acetates;
- and
- at least one solvent in an amount of from about 1 wt % to about 99 wt % of the surface treatment composition;
- wherein the surface treatment composition is substantially free of propylene glycol methyl ether acetate and is substantially free of an additional Si-containing compound other than the at least one trialkylsilyl compound.
1 more element
-24. (canceled)
-46. (canceled)
A surface treatment composition, consisting of:
- at least one trialkylsilyl compound in an amount of from about 0.1 wt % to about 15 wt % of the surface treatment composition, the at least one trialkylsilyl compound being selected from the group consisting of trialkylsilyl alkylsulfonates, trialkylsilyl arylsulfonates, and trialkylsilyl acetates;
- and
- at least one siloxane compound in an amount of from about 85 wt % to about 99.9 wt % of the surface treatment composition.
-56. (canceled)
Dependencies are inferred from the claim text.