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US 2024/0258103 A1Published application
Plasma treatment of barrier and liner layers
AssigneeApplied Materials, Inc.
InventorsJiajie Cen, Ge Qu, Shinjae Hwang, Zheng Ju, Yang Zhou, Zhiyuan Wu, Feng Chen, Kevin Kashefi
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Abstract
Embodiments of the disclosure relate to methods for forming electrical interconnects. Additional embodiments provide methods of forming and treating barrier and liner layers to improve film and material properties. In some embodiments, the resulting composite layers provide improved resistivity, decrease void formation and improve device reliability.
Claims21
A method of forming electrical interconnects, the method comprising:
- forming a barrier layer within a substrate feature;
- forming a liner layer on the barrier layer;
- and
- treating the liner layer and the barrier layer to form a treated composite, wherein the barrier layer is not densified before deposition of the liner layer.
1 more element
A method of forming electrical interconnects, the method comprising:
- forming a barrier layer within a substrate feature;
- treating the barrier layer to form a treated barrier layer;
- forming a liner layer on the treated barrier layer;
- and
- treating the liner layer and the treated barrier layer to form a treated composite.
2 more elements
Dependencies are inferred from the claim text.