Substrate processing apparatus and substrate support

Abstract

There is a substrate processing apparatus comprising: a processing chamber; a substrate support disposed in the chamber; and a power supply configured to supply a radio frequency (RF) power to at least the substrate support, wherein the substrate support includes: an electrostatic chuck that is made of ceramic and holds a substrate by electrostatic attraction; a base that has a channel through which a heat exchange medium flows and supports the electrostatic chuck; a low linear expansion coefficient member disposed between the electrostatic chuck and the base; a heat transfer sheet disposed between the low linear expansion coefficient member and the base; a fixing part configured to fix the heat transfer sheet to the low linear expansion coefficient member; and a conductive member that is disposed between the low linear expansion coefficient member and the base and electrically connects the low linear expansion coefficient member and the base.

Dependencies are inferred from the claim text.