Spray-coated electrostatic chuck design
AssigneeApplied Materials, Inc.
InventorsTuck Foong KOH, Sarath BABU, Yuichi WADA
Life of this patent
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Abstract
Embodiments of the disclosure include a substrate support including a metal body with a substrate face, a plurality of lift pin holes formed in the body, and a dielectric coating disposed on the substrate face of the body. Each of the plurality lift pin holes includes a through hole and a chamfer face configured to mate with a lift pin sleeve. The dielectric coating includes a substrate supporting surface, a thickness, and a pattern disposed in the substrate supporting surface.
Claims20
A substrate support, comprising:
- a body having a substrate face, wherein the body comprises a metal;
- a plurality of lift pin holes formed in the body, wherein each of the plurality lift pin holes comprise:
- a through hole;
- and
- a chamfer face extending between a substrate face and the through hole, wherein the chamfer face is configured to mate with a lift pin sleeve of a plurality of lift pin sleeves;
- and
- a dielectric coating disposed on the substrate face and the chamfer face, wherein the dielectric coating comprises:
- a substrate supporting surface;
- a thickness;
- and
- a pattern disposed in the substrate supporting surface.
An electrostatic chuck assembly, configured to support a substrate when the substrate is disposed on an electrostatic chuck, wherein the electrostatic chuck assembly comprises:
- a body of the electrostatic chuck assembly;
- a substrate face configured to face a substrate;
- a dielectric coating disposed on the body, wherein the dielectric coating comprises:
- a top;
- a thickness;
- and
- a pattern disposed in the substrate face;
- a plurality of lift pin holes disposed in the body, wherein each of the plurality lift pin holes comprise:
- a top face coated by the dielectric coating;
- a chamfer face coated by the dielectric coating;
- and
- a depth;
- and
- a plurality of lift pin sleeves, disposed within the plurality of lift pin holes, wherein the each of the plurality of lift pin sleeves comprises:
- a sleeve body comprising a sleeve material;
- a substrate face;
- a pin hole disposed through the sleeve body;
- and
- a chamfer disposed on an exterior of the sleeve body.
A method of manufacturing a body of an electrostatic chuck assembly comprising:
- forming a body comprising:
- a substrate face;
- and
- a base face;
- forming a plurality of lift pin holes through the substrate face of the body to the base face of the body;
- chamfering the plurality of lift pin holes in the substrate face of the body;
- coating the body with a dielectric coating;
- forming a pattern in the dielectric coating disposed over the substrate face;
- and
- polishing the dielectric coating disposed over the substrate face.
Dependencies are inferred from the claim text.